特点:Low loss and high attenuation; Ultra small size; light weight and low profile; For RFFE module use
应用:4G LTE
晶圆级封装（WLP）
特点:Low loss and high attenuation; Ultra small size; light weight and low profile; RoHS compliant; High resistance to molding pressure; For RFFE module use
应用:4G LTE
芯片级封装（CSP）
特点:Low loss and high attenuation Small size and light weight; RoHS compliant;
应用:4G LTE
芯片级封装（CSP）
特点:Compact (1.4 x 1.1 x 0.5 mm typ., ); RoHS compliant; MSL3
应用:IMS, LPWA, etc.
陶瓷封装（Ceramic）
特点:Compact (3.0 x 3.0 mm typ., )RoHS compliant; MSL1
应用:IMS, LPWA, etc.
芯片级封装（CSP）
特点:Ultra compact (1.4 x 1.1 x 0.56 mm typ., ); RoHS compliant; AEC-Q200 compliant; MSL3
应用:Navigation system; Bluetooth low energy
陶瓷封装（Ceramic）
特点:Compact (3.0 x 3.0 x 1.05 mm typ., ); RoHS compliant; AEC-Q200 compliant; MSL1
应用:Body control module(RKE,TPMS); Navigation system; Bluetooth low energy etc.
陆上移动卫星通讯（Land Mobile）
特点:Compact (3.0 x 3.0 mm typ., ); 2in1 filter; RoHS compliant; MSL1
应用:Land Mobile
基站（Basesation）
特点:Compact (3.0 x 3.0 mm typ., ); RoHS compliant; MSL1
