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IC film:Die-Attach-Film, IC film is mainly to ensure the stability and integrity of the die during the chip production process, and prevent the wafer from displacement, flying, and back collapse during processing such as grinding and dicing. In the chip packaging production process, there are a total of three processes that require the use of IC film, which are the film for polishing, the film for dicing, and the film for dicing after plastic packaging.




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